0 8mm 1050 Aluminum Nitride Plate for Insulation

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High thermal conductivity and excellent electrical insulation are the two main properties of Aluminum Nitride ceramic. AlN substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor... UNIPRETEC's standard Aluminum Nitride Ceramic Substrate s are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also ...

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Aluminum Nitride Aln Ceramic Plate For Electronic. The Aluminum Nitride(AlN) ceramic has high thermal coductivity(5-10 times as the Alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance, and the linear expansion cofficient is similar with Si, which is widely used in ...

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Quick Details Model Number: Customized Type: Insulating Ceramics Material: Aluminum Nitride Purity: >95% Color: Grey Density: 3.3g/cm3 Water Absorption: 0% Moh's Hardness: 8 Thermal Conductivity: ≥175w/mk Coefficient of Thermal Expansion: 4.6 x 10^-6 Volume Resistivity: >10^13Ω.cm Dielectric Strength: 17 Product Description Product Name Industrial Ceramics Thin Thickness 1mm Aluminum Nitride...

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The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance,chemical resistance, and the linear expansion coefficient is similar with Si.

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High thermal conductivity and excellent electrical insulation are the two main properties of Aluminum Nitride ceramic. AlN substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor... UNIPRETEC's standard Aluminum Nitride Ceramic Substrate s are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also ...

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AlN ceramic substrate with high thermal conductivity, good electrical properties, thermal expansion coefficient close to Silicon wafer, non-toxic, is an ideal material to replace BeO ceramics, is an ideal large-scale integrated circuit heat sink substrate and packaging materials. AlN ceramic substrate has excellent thermal conductivity (5-10 ...

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Advantages of Aluminum Nitride The conductivity of Aluminum Nitride is about 5-10 times of Alumina Ceramics. The thermal expansion coefficient is close to silicon It has high electrical insulation and low dielectric constant. It has good mechanical strength. Good corrosion resistance to molten metal, especially for molten aluminum

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Quick Details Model Number: Customized Type: Insulating Ceramics Material: Aluminum Nitride Purity: >95% Color: Grey Density: 3.3g/cm3 Water Absorption: 0% Moh's Hardness: 8 Thermal Conductivity: ≥175w/mk Coefficient of Thermal Expansion: 4.6 x 10^-6 Volume Resistivity: >10^13Ω.cm Dielectric Strength: 17 Product Description Product Name Industrial Ceramics Thin Thickness 1mm Aluminum Nitride...

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